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Different
quality
One-step process |
| In the one-step process,
chipboard or HDF substrates and decorative sheet plus overlay, are
bonded in a single operation. |
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 High-grade,
durable wear surface (overlay)- Melamine-resin impregnated decorative sheets with modern
wood and stone effect designs
- HDF or chipboard E1
- Damp-proofing back pull for shape stability
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Chipboard |
HDF |
- improved glue absorption in
the core and spring area
- improved adhesion along the
narrow sides
- improved sound insulation
- improved reverse suspension
- simple replacement of small
damaged areas or panels
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- closed pores mean higher
resistance to dampness
- higher resistance to
pressure
- greater stability in the
core and spring area
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Two-step-process
(CPL = continually pressed laminate, HDF = high pressed laminate) |
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