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Products: Quality - Two-step process
  Product Overview

.
Different Quality
Two-step
process

In the two-step process, first of all a laminate of various core papers, decorative sheet and overlay are joined to form a 0.8 mm strong laminate.

In the second step, the laminate is bonded onto the chipboard or HDF substrate.

  Structure
  1. High-grade, durable surface (overlay)
  2. Melamine-resin impregnated decorative papers with modern wood and imaginative designs
  3. Core papers
  4. Laminate layer highly resistant to abrasion 0.8 mm
  5. HDF or chipboard E1
  6. Laminate layer back pull — 8 mm
  Advantages and Qualities   
  Chipboard    HDF
  • improved glue absorption in the core and spring area
  • improved adhesion along the narrow sides
  • improved sound insulation
  • improved reverse suspension
  • simple replacement of small damaged areas or panels
  • closed pores mean higher resistance to dampness
  • higher resistance to pressure
  • greater stability in the core and spring area
One-step process  (DPL = directly pressed laminate)
Technical Support by:
www.i-mw.net

KAINDL FLOORING GmbH  //  www.kaindl.com.hk  //  sales@kaindl.com.hk
 
  Phone: (852) 3118-7988  //  Fax: (852) 3426-3332